Component Cleaning Operation
Impurities of semiconductor components are first removed by chemical stripping, physical scraping and sandblasting. The components are then subjected to high-frequency ultrasonic cleaning. The high-speed impact of the dynamic sound wave vibration energy is used to remove the stains on the components. During ultrasonic cleaning, substantial vacuum bubbles will be generated, which can penetrate into the fine cavities, concave surfaces or other blind spots of the components to achieve a comprehensive cleaning effect.